Detecting Microcracks, Hotspots and Junction Box Failures — Thermal Patterns Explained

Thermal anomalies appear in diverse patterns: single-cell hotspots, multi-cell degradation, diode failures, cracked modules and overheating junction boxes. We break down each pattern and show how high-resolution thermal imagery allows early fault classification long before visible defects appear in production data.

Leave a Reply

El. pašto adresas nebus skelbiamas. Būtini laukeliai pažymėti *